EPO-TEK® B9144 - Nonconductive Adhesive

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant. 

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. 

A high-strength epoxy grout used primarily when extreme early compressive strength is required. With past experience using this grout and results greater than 20,000 PSI in 24 hours, it is a game changer for the extra large compressor...

Hoses for DP 2590 Duct Liner Adhesive and DP 2595 Closed Cell Foam Adhesive canisters. AVAILABLE IN 12 FT. LENGTHS.

ASI 335 Neutral Cure RTV Silicone is a one-part, non-slump, moisture cure sealant/adhesive that cures to form a tough rubber with long-term flexibility and durability.Due to the formulation, ASI 335 offers advanced adhesion to a variety of surfaces...

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.