EPO-TEK® EK1000-MP - Silver Conductive Epoxy

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration. 

Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk.