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100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
Contact our customer service or sales representative for more information.
High Performance Hybrid Sealant & Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...
Optical Grade Epoxy
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
Thermally Conductive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
UV Curable
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
Thermally Conductive
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
Electrically & Thermally Conductive Epoxy
High thermal conductivity version of EPO-TEK® H20E.
High Performance Hybrid Sealant & Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...
Optical Grade Epoxy
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
Thermally Conductive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
UV Curable
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
Thermally Conductive
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
Electrically & Thermally Conductive Epoxy
High thermal conductivity version of EPO-TEK® H20E.
Speak to us on 1-978-667-3805
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