EPO-TEK® H20E - Silver Filled Electrically Conductive Epoxy

H20e 01

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

SDS
TDS
Brand:
Epoxy Technology
Technology:
Epoxy
Application:
Consumer Electronics and PCBA E-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind
Market:
Aerospace and Defense Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom
Function:
Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

Related Products

Viewing options:
EPO-TEK® 353ND

EPO-TEK® 353ND

Low Outgassing Optical Epoxy

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

SDS TDS
View product
EPO-TEK® 323LP

EPO-TEK® 323LP

High Temperature Optical Epoxy

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

SDS
TDS
View product
20-3060

20-3060

Impact Resistant Epoxy

Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.

SDS
TDS
View product
50-3152FR

50-3152FR

Thermally Conductive Potting Epoxy

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

SDS
TDS
View product
EPO-TEK® OG198-55

EPO-TEK® OG198-55

Biocompatible UV Curing Epoxy

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

SDS
TDS
View product
EPO-TEK® H37-MP

EPO-TEK® H37-MP

Low Temperature Cure Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

View product

Get in touch to learn more

Speak to us on 1-978-667-3805

Contact us