EPO-TEK® H20E: Silver Filled Conductive Epoxy

Features

Silver-filled epoxy with a smooth, thixotropic consistency (Thixotropic 4.6)
More than 10kg die shear strength
Meeting NASA E595 low outgassing standard

Applications

Semiconductor IC Packaging (e.g. die attach, flip chip applications, ultrafine pitch SMD printing etc.)
Hybrid Microelectronics (e.g. SMD attach adhesive, EMI and RF shielding of RF, microwave and IR devices etc.)
Solar-Photovoltaic (e.g. common “solar cell stringing” adhesive, chip attached in solar concentrator etc.)
Optoelectronics Packaging ( e.g. die bonds laser diodes for fiber optic components, die-attaching LED chips etc.)

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name epotek®

File Size 624.8 KB

View

Safety Data Sheet

Document Name EPO-TEK® H20E Safety Data Sheet

File Size 1.0 MB

View

Safety Data Sheet

Document Name EPO-TEK® H20E Safety Data Sheet Syringe

File Size 872.2 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA E-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind

Market:

Aerospace and Defense Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

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Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® H20E - Electrically & Thermally Conductive Epoxy

Features

Applications

Downloads

Certifications