Features
- Silver-filled epoxy with a smooth, thixotropic consistency (Thixotropic 4.6)
- More than 10kg die shear strength
- Meeting NASA E595 low outgassing standard
Applications
- Semiconductor IC Packaging (e.g. die attach, flip chip applications, ultrafine pitch SMD printing etc.)
- Hybrid Microelectronics (e.g. SMD attach adhesive, EMI and RF shielding of RF, microwave and IR devices etc.)
- Solar-Photovoltaic (e.g. common “solar cell stringing” adhesive, chip attached in solar concentrator etc.)
- Optoelectronics Packaging ( e.g. die bonds laser diodes for fiber optic components, die-attaching LED chips etc.)
Downloads
Certifications
- ROHS Compliance / REACH Compliance / Meet NASA ASTM E595
Available Packaging
Notes
Contact our customer service or sales representative for more information.
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