EPO-TEK® H20E: Silver Filled Conductive Epoxy

Features

Silver-filled epoxy with a smooth, thixotropic consistency (Thixotropic 4.6)
More than 10kg die shear strength
Meeting NASA E595 low outgassing standard

Applications

Semiconductor IC Packaging (e.g. die attach, flip chip applications, ultrafine pitch SMD printing etc.)
Hybrid Microelectronics (e.g. SMD attach adhesive, EMI and RF shielding of RF, microwave and IR devices etc.)
Solar-Photovoltaic (e.g. common “solar cell stringing” adhesive, chip attached in solar concentrator etc.)
Optoelectronics Packaging ( e.g. die bonds laser diodes for fiber optic components, die-attaching LED chips etc.)

Downloads

Type

Document Name

File Size

Safety Data Sheet

Document Name EPO-TEK® H20E Safety Data Sheet

File Size 1.0 MB

View

Safety Data Sheet

Document Name EPO-TEK® H20E Safety Data Sheet Syringe

File Size 872.2 KB

View

Technical Data Sheet

Document Name EPO-TEK® H20E

File Size 622.5 KB

View

Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA E-mobility Microelectronics/Semiconductors Off-shore Drilling Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors Solar/Wind

Market:

Aerospace and Defense Automotive and Transportation Electronics Oil and Renewable Energy Optical, Datacom and Telecom

Function:

Bonding Electrical Connection High Temperature Sealing Thermal Transfer

Available Packaging

Notes

Contact our customer service or sales representative for more information.

Related Products

Viewing options:

50-3150RFRBK

Electrically Insulating Epoxy

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

TDS

20-3302

Ultra Clear Epoxy Resin for Adhesives & Sealants

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

TDS

10-3216

Impact Resistant Adhesive

Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

TDS

70-3812NC

Aluminum Filled Epoxy

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

TDS

60-7185RCL

UV Curable Urethane Acrylate

Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.

SDS TDS

EPO-TEK® 343ND-LH

Optical Epoxy Adhesive

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

TDS

Get in touch to learn more

Speak to us on 1-978-667-3805

EPO-TEK® H20E - Silver Filled Electrically Conductive Epoxy

Features

Applications

Downloads

Certifications