EPO-TEK® H70E

Features

Heat-sinking adhesive
Excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Passes NASA low outgassing standard ASTM E595

Applications

Chip bonding in microelectronic and optoelectronics applications.
Fast circuit repairs
Snap-cured for in-line semiconductor die-bonding

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® H70E TDS

File Size 575.9 KB

View

Safety Data Sheet

Document Name EPO-TEK® H70E SDS

File Size 415.1 KB

View

Safety Data Sheet

Document Name EPO-TEK® H70E Syringe SDS

File Size 446.7 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA Datacom and Telecom E-mobility Microelectronics/Semiconductors Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Encapsulation Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

EPO-TEK® OG142-112-LH

UV Curable Epoxy Adhesive

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

TDS

20-2362FR

Fire Retardant Urethane

Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.

TDS

EPO-TEK® H20E-HC

High Thermal Conductivity Epoxy

High thermal conductivity version of EPO-TEK® H20E.

SDS TDS

ASI 505

Industrial Grade Silicone Self Leveling

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

SDS TDS

EPO-TEK® OG198-55

Biocompatible UV Curing Epoxy

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

TDS