EPO-TEK® H70E

Features

Heat-sinking adhesive
Excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Passes NASA low outgassing standard ASTM E595

Applications

Chip bonding in microelectronic and optoelectronics applications.
Fast circuit repairs
Snap-cured for in-line semiconductor die-bonding

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® H70E TDS

File Size 575.9 KB

View

Safety Data Sheet

Document Name EPO-TEK® H70E SDS

File Size 415.1 KB

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Safety Data Sheet

Document Name EPO-TEK® H70E Syringe SDS

File Size 446.7 KB

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Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Consumer Electronics and PCBA Datacom and Telecom E-mobility Microelectronics/Semiconductors Radar Systems, Navigation and Sensors

Market:

Aerospace and Defense Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding Encapsulation Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

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