Features
- Heat-sinking adhesive
- Excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
- Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
- Passes NASA low outgassing standard ASTM E595
Applications
- Chip bonding in microelectronic and optoelectronics applications.
- Fast circuit repairs
- Snap-cured for in-line semiconductor die-bonding
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

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Speak to us on 1-978-667-3805
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Electrically Insulating EpoxyLet's talk
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