EPO-TEK® HYB-353ND-LV - Low Viscosity UV Hybrid Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

Non-yellowing UV urethane adhesive and encapsulant.

Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping