Features
- Capable of curing at low temperatures in the range of 23°C to 80°C
Applications
- Opto-device flip chip packaging
- General potting and encapsulation
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.
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Get in touch to learn more
Speak to us on 1-978-667-3805
Contact usEPO-TEK® OE121
Underfill EpoxyLet's talk
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