EPO-TEK® OE121

Oe121 01

Underfill Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used for general potting and encapsulation. 

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