EPO-TEK® OG142-112-LH | UV Curable Epoxy

Features

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OG142-112-LH TDS

File Size 861.6 KB

View

Safety Data Sheet

Document Name EPO-TEK® OG142-112LH

File Size 283.3 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Optical Sensors and Camera Modules

Market:

Automotive and Transportation Optical, Datacom and Telecom

Function:

Bonding Encapsulation

Related Products

Viewing options:

EPO-TEK® H20S

Silver Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

SDS TDS

EPO-TEK® HYB-353ND-HV

UV Hybrid Curing Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

SDS TDS

EPO-TEK® HYB-353ND

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.

SDS TDS

EPO-TEK® 301-2

Optically Transparent Epoxy Resin

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.

TDS

EPO-TEK® HYB-353ND-LV

Low Viscosity UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

SDS TDS