Features
- A single component, low viscosity cure epoxy
- Electrically and thermally insulating
- High Tg
- Strong transmission in the visible and IR regions
Applications
- Active alignment of optics
- Bonding fibers to V-grooves
- Fiber pigtails
- Alignment in optoelectronic hybrids
- Micro lens molding
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.

EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.

EPO-TEK® 320
Thixotropic Optical Epoxy Adhesive
Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® 320
Thixotropic Optical Epoxy Adhesive
Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® OG198-54
UV Curable EpoxyLet's talk
We're here to help you create the perfect product.