About
Overview
Overview

Why Meridian?

Vision, mission & values

News / press releases

Leadership

Our portfolio
Our brands
Products
Product finder
Acetoxy Silicone

Acrylic

Dextrin

Emulsion

Epoxy

Hotmelt

Hybrid

Lithium, colloidal & strontium

Neutral Silicone

Polyurea

rPVB

Silane Modified

Silicone

Synthetic Latex

Synthetic Rubber

Urethane

UV Cure

Vinyl Ester

View all technologies

Automotive Repair/Assembly

Bridge, Roadway & Preservation

Building components

Concrete Construction and Restoration

Consumer Electronics & PCBA

Datacom & Telecom

E-Mobility

Flexible Packaging

Flooring Adhesives

Furniture

HVAC

Imaging & Diagnostics

Interior Finishing

Medical Devices

Microelectronics/Semiconductor

Off-Shore Drilling

Optical Sensors, Camera Modules and LIDAR

Paper & Cardboard

Radar Systems, Navigation & Sensors

RV, Trailer & Mobile Home

Solar / Wind

Tape & Label

View all applications

Our brands
Our brands
Brands
Overview
Overview

Adhesives Technology

American Sealants Inc

Bondloc UK Ltd

Design Polymerics

eChem

Epoxies Etc.

Epoxy Technology

Epoxy Technology Europe

Evans

Pacific Adhesive Systems

Polycom

Taylor Adhesives
Capabilities
Overview
Overview

Private label

Product development

Contract & toll manufacturing
Markets
Overview
Overview

Aerospace & Defense

Automotive & Transportation

Building Construction

Electronics

Industrial Assembly

Infrastructure

Medical

Oil & Renewable Energy

Optical, Datacom & Telecom

Packaging
Contact
Product finder
Resources & Insights
Careers

Product finder

EPO-TEK® OG198-55 - Biocompatible UV Curing Epoxy

Og198 55

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

TDS

Og198 55

Features

High Tg, translucent UV cure epoxy
Electrically and thermally insulating
Strong transmission above 560 nm
UV shadow cure allows for enhanced performance after a thermal post cure and significant cure propagation into shadow area.

Applications

Active alignment of optics
Bonding fibers to V-grooves
Fiber pigtails
Alignment in optoelectronic hybrids Semiconductor devices
General bonding including structural adhesive in commercial LED lighting

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® OG198-55 Technical Data Sheet

File Size 899.5 KB

View

Safety Data Sheet

Document Name EPO-TEK® OG198-55 Safety Data Sheet

File Size 179.6 KB

View

Safety Data Sheet

Document Name EPO-TEK® OG198-55 Safety Data Sheet Syringe

File Size 180.3 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

E-mobility Microelectronics/Semiconductors Optical Sensors and Camera Modules Radar Systems, Navigation and Sensors

Market:

Automotive and Transportation Electronics Optical, Datacom and Telecom

Function:

Bonding

Related Products

Viewing options:

EPO-TEK® EK1000

Conductive Silver Filled Adhesive

High thermal conductive silver filled adhesive.

TDS

EPO-TEK® OG198-54

UV Curable Epoxy

Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.

TDS

EPO-TEK® HYB-353ND-TX2

UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

SDS TDS

EPO-TEK® H70E

Electrically Insulating Epoxy

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

TDS

EPO-TEK® 377H

Graphite Filled Bonding Epoxy

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

TDS

EPO-TEK® 320

Thixotropic Optical Epoxy Adhesive

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.

TDS

Get in touch to learn more

Speak to us on 1-978-667-3805