Features
- High Tg, translucent UV cure epoxy
- Electrically and thermally insulating
- Strong transmission above 560 nm
- UV shadow cure allows for enhanced performance after a thermal post cure and significant cure propagation into shadow area.
Applications
- Active alignment of optics
- Bonding fibers to V-grooves
- Fiber pigtails
- Alignment in optoelectronic hybrids Semiconductor devices
- General bonding including structural adhesive in commercial LED lighting
Certifications
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EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEK® 343ND-LH
Optical Epoxy Adhesive
Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND
EPO-TEK® 320
Thixotropic Optical Epoxy Adhesive
Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy.


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EPO-TEK® OG198-55
Biocompatible UV Curing EpoxyLet's talk
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