EPO-TEK® P1011ST-2 - Silver Die Attach Polyimide

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

A premium quality, solvent based, high performance, fast drying, non-flammable, industrial contact insulation adhesive that is water resistant and temperature resistant to 200°F. DP 2595 is formulated for adhering closed cell foam, higher density insulation and applications that...

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

A medium viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 can be used for bonding and coating jackets of canvas, glass cloth and...