EPO-TEK® TZ101 - Thermally Conductive Adhesive

930 4

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

SDS TDS
Where to buy
Brand:
Epoxy Technology
Technology:
Epoxy
Application:
Consumer Electronics and PCBA Microelectronics/Semiconductors Optical Sensors and Camera Modules
Market:
Electronics Optical, Datacom and Telecom
Function:
Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:
60-7107RTR

60-7107RTR

Electronic Epoxy Adhesive

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

SDS TDS
View product
EPO-TEK® EK1000

EPO-TEK® EK1000

Electrically Conductive Silver Filled Adhesive

High thermal conductive silver filled adhesive.

SDS TDS
View product
EPO-TEK® H20E

EPO-TEK® H20E

Silver Filled Electrically Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

SDS
TDS
View product
EPO-TEK® H37-MP

EPO-TEK® H37-MP

Low Temperature Cure Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

SDS TDS
View product
EPO-TEK® H70S

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

SDS TDS
View product
EPO-TEK® OG198-55

EPO-TEK® OG198-55

Biocompatible UV Curing Epoxy

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

SDS
TDS
View product

Get in touch to learn more

Speak to us on 1-978-667-3805

Contact us