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EPO-TEK® 730

General Bonding

All purpose thixotropic and room temperature-curing epoxy adhesive.

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EPO-TEK® 730-110

General Bonding

Room temperature-curing, thermally and electrically insulating epoxy.

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EPO-TEK® 930-4

Thermally Conductive Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

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EPO-TEK® EK1000

Electrically & Thermally Conductive Epoxy

High thermal conductive silver filled adhesive.

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EPO-TEK® H20E

Electrically & Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

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EPO-TEK® H20E-HC

Electrically & Thermally Conductive Epoxy

High thermal conductivity version of EPO-TEK® H20E.

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EPO-TEK® H20E-MP

Electrically & Thermally Conductive Epoxy

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

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EPO-TEK® H20S

Electrically & Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic 

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EPO-TEK® H21D

Electrically & Thermally Conductive Epoxy

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

TDS