EPO-TEK® TR2139-LH
Low Halogen Thermally Conductive Epoxy
Two component, electrically insulating epoxy adhesive designed to meet low halogen standards.
EPO-TEK® TV2001
Thermally Conductive Epoxy
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® U300-22
Optically Clear Epoxy
This epoxy offers a long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy suitable for electronic applications such as smart cards, RFIDs, and wafer level camera optics.
EPO-TEK® UD1214
Dual UV-Thermally Curing Epoxy
Optically opaque, UV hybrid epoxy. It is especially designed for UV fast cure and following low temperature (< 80C) curing for shadow areas. It can be used as adhesive, sealing and encapsulation in semiconductor, electro-optics, fiber optics, circuit...
EPO-TEK® UD1355
Epoxy-Based Thermal Post Cure
Optically clear, low-viscosity UV adhesive and encapsulant with resistance to discoloration during solder reflow.
EPO-TEK® UD1927
UV & UV Hybrid
Single component, low viscosity UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
EPO-TEK® UJ1190
Epoxy-Based Thermal Post Cure
Low-viscosity, clear UV epoxy ideal for thick sections.
