50-3151
Flame Retardant Thermally Conductive Epoxy Resin
50-3151NCFR has been formulated to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. 50-3151NCFR is low in viscosity and therefore offers outstanding flow around components.
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
50-3155
Thermally Conductive Epoxy Resin
50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications where electrical insulation and mechanical protection must be maintained while transferring heat.
50-3167
Thermally Conductive Epoxy Resin
50-3167 is a two-part epoxy that offers excellent heat transfer, low shrinkage, and outstanding insulation properties.
50-3170
Thermally Conductive Epoxy Rubber Repair Adhesive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
50-3182
Thermally Conductive Epoxy Resin
50-3182NC is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182NC offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion.
50-3185
Thermally Conductive Potting & Encapsulating Resin
50-3185NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required.
50-3186
Very High Temperature Resistant Epoxy Adhesive
50-3186NC is a two-part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature...
50-3253
Flame Retardant Thermally Conductive Epoxy Resin
50-3253FR Potting and Encapsulating Compound has been formulated to meet the stringent nonburning requirements of UL 94 V-0. This medium viscosity system offers high thermal conductivity, low shrinkage, low exotherm, and outstanding electrical insulation properties.
