EPO-TEK® 360ST
Thixotropic Optical Epoxy
This is a two component, high temperature grade, electrically and thermally insulation epoxy. It is a less thixotrop version of EPO-TEK® 360T.
EPO-TEK® 360T
High Temperature Thixotropic Epoxy
This is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, and fiber optics applications. It is a thixotropic paste for non-flow properties.
EPO-TEK® 375
High Temperature Optical Epoxy
This two-component, high temperature epoxy designed for semiconductors, hybrid, and fiber optic applications. Also available in a single component frozen syringe.
EPO-TEK® 375-T
Optical Epoxy
Higher viscosity version of EPO-TEK® 375. Designed for use in fiber optic applications.
EPO-TEK® 377
High Temperature, Fiber Optic Epoxy
EPO-TEK® 377 is a two-component, high Tg epoxy ideal for fiber optics, semiconductor, and optical applications. Its low viscosity ensures excellent handling and versatility in application methods, including encapsulating and potting. NASA-approved for low outgassing,
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.
EPO-TEK® 383ND
High Temperature Optical Epoxy
EPO-TEK® 383ND is a two component, high temperature, electrically and thermally insulating epoxy. Designedas a longer pot life version of EPO-TEK® 353ND.
EPO-TEK® 430
Electrically Conductive Epoxy
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
