10-2170
Low Viscosity Polyurethane Adhesive
10-2170 is a liquid, low viscosity, urethane resin formulated for casting or adhesive applications
10-3001
High Strength Epoxy Adhesive
10-3001 is a high bond strength epoxy adhesive that yields high peel strength, excellent tensile strength, along with outstanding thermal shock, impact and vibration resistance. This high-performance epoxide adhesive also exhibits outstanding physical, thermal, and electrical insulation properties.
10-3002
Adjustable Flexibility Epoxy Adhesive
10-3002 is a high bond strength epoxy adhesive that has a non-critical mix ratio and adjustable flexibility. It yields high peel strength and excellent tensile strength. has outstanding thermal shock, impact and vibration resistance.
10-3004NC
Low Viscosity, Adjustable Flexibility Epoxy Adhesive
10-3004NC is a high bond strength epoxy adhesive, with a non-critical mix ratio and adjustable flexibility. 10-3004NC yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high-performance epoxy...
10-3006
Non-Sag Patch & Repair Epoxy System
10-3006 is a non-sag fast setting patch & repair epoxy system and is dry to the touch in 5-10 minutes.
10-3009NC
Low Viscosity Epoxy Adhesive & Potting Compound
10-3009 NC is a low viscosity epoxy adhesive and potting compound. This product offers a good combination of peel and tensile strength. 10-3009 NC provides electrical insulation and outstanding adhesion.
10-3011
Fast Curing Epoxy Adhesive
10-3011 is a two component fast curing epoxy adhesive. This system provides a rapid cure in thin films and at low temperatures.
10-3012
Fast Setting Epoxy Adhesive
10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance
10-3013
Instant Setting Cyanoacrylate Adhesive
10-3013 is a medium viscosity, instant setting Ethyl Cyanoacrylate adhesive. This fast-setting adhesive is formulated for the bonding of plastics, rubbers, paper, metals, and other common substrates.