EP100-SEAL LM
Low Viscosity Epoxy Sealer
EP100-SEAL LM is a highly penetrating, two-component epoxy healer/sealer.
EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.
EP50-SC
Fast-Setting, Low-Modulus Epoxy Polymer
EP50-SC (Standard Cure) is a moisture-insensitive, 100% solids epoxy polymer engineered for skid-resistant overlay systems and other demanding infrastructure applications. Designed to provide exceptional bond strength, high early strength, and long-term durability, EP50-SC delivers reliable performance on bridge...
EP75-SEAL
Penetrating Healer and Urethane Sealer
EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® 301-1
Spectrally Transparent Epoxy
This is a two-component, room temperature curing epoxy featuring very low viscosity and excellent optical and mechanical properties. It is a lower viscosity version of EPO-TEK® 301.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® 301-2FL
Low Stress Optical Epoxy
This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding...
EPO-TEK® 301-2FL-CX
Low Viscosity Optical Epoxy
This a two component optical epoxy low index version of EPO-TEK® 301-2FL. It features very low viscosity and excellent optical-mechanical properties.
