EPO-TEK® 730 Black
General and Structural Grade Epoxy
This is a two component, room temperature curing, general and structural Grade epoxy resin. It can be used for adhesive and sealing applications in medical, x-ray device, filtration, opto-electronics, and PCB industries. It is a thixotropic, black version...
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® 920
High Tg, Thermally Conductive, Electrically Insulating Epoxy
This product is designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal...
EPO-TEK® 920-FL
Thermally Conductive Epoxy
This product is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.
EPO-TEK® 921
High Tg,Thermally Conductive, Electrically Insulating Epoxy
Designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® B13181
Thermally Conductive Epoxy
A single component, thermally conductive, low-halogen, B-Stage epoxy paste.
EPO-TEK® E2101
Electrically Conductive, Silver Epoxy
A two component, thixotropic, electrically conductive adhesive.
EPO-TEK® E3001-6
Electrically Conductive, Silver-Filled Epoxy
This is a single component, electrically and thermally conductive,snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK®...
