EPO-TEK® EK1000-1-D
Silver Conductive Epoxy
A longer dry time and low viscosity version of EPO-TEK® EK1000 designed for applications requiring longer working time and better flowing than provided by EPO-TEK® EK1000. Offers exceptional thermal management.
EPO-TEK® EK1000-1MP
Electrically Conductive, Silver Epoxy
This single component product offers exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK® EK1000-MP and is designed for applications requiring long work times including hybrid die...
EPO-TEK® EK1000-MP
Silver Conductive Epoxy
A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.
EPO-TEK® EK2000
Exceptional Electrical Conductivity
This silver-filled adheseivs exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making...
EPO-TEK® EV2118-2
Silver Conductive Epoxy
A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® H20E-FC
Electrically Conductive, Silver Epoxy
EPO-TEK® H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.
EPO-TEK® H20E-HC
High Thermal Conductivity Epoxy
High thermal conductivity version of EPO-TEK® H20E.
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.