EPO-TEK® H62
Thermally Conductive Epoxy
A single component, electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H70E-2
Thermally Conductive, Electrically Insulating Epoxy
A two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Ease of use: long pot-life with low temperature cure of 80°C possible.
EPO-TEK® H70E-4
Thermally Conductive Epoxy
This is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
EPO-TEK® H74
Thermally Conductive Epoxy
This thermally conductive epoxy is designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.
EPO-TEK® H77
Thermally Conductive, Electrically Insulating Epoxy
Designed for lid sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases, or ceramic.
