EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® H22
Electrical Conductive, Silver Epoxy
This silver-filled system is engineered specifically for die bonding and sealing hybrid circuit packages.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H35-175MPLV
Silver Conductive Epoxy
A single-component, silver-filled epoxy engineered for hybrid die and component attachment, featuring a lower viscosity formulation compared to EPO-TEK® H35-175MP.
EPO-TEK® H35-175MPT
Silver Conductive Epoxy
A single component, silver-filled epoxy for hybrid die and component attach. This product is a higher thixotropic version of EPO-TEK® H35-175MP.
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® H37-MPT
Silver Conductive Adhesive
A single component, silver-filled and electrically conductive adhesive designed for smeiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly.
EPO-TEK® H37MP-2
Silver Conductive Epoxy
A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging.
EPO-TEK® H61
Thermally Conductive Epoxy
A single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.
