EPO-TEK® OE145-7
Nonconductive Adhesive
Thixotropic version of EPO-TEK® 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. Ideal for adhesive joining, sealing, potting, or as a coating.
EPO-TEK® OE175-2
Hight Temperature Epoxy
Two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is a modified alternative to EPO-TEK® 375 with improved wetting.
EPO-TEK® OE184
Nonconductive Adhesive
A two component, high Tg, optically clear epoxy for packaging and assembly of fiber optics cables and components. It is suggested for termination of fibers into ferrules, or fabrication of waveguide devices. It is a faster curing alternative...
EPO-TEK® OE188
High Temperature, Low CTE Epoxy
Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor and fiber optic industries.
EPO-TEK® OE188-3
Low CTE Epoxy
Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor, hybrid, sensor device, and fiber industries.
EPO-TEK® OG116
Epoxy-Based Thermal Post Cure
A single-component, high-index, high glass transition temperature (Tg), UV-curable adhesive with high viscosity. Offers good chemical resistance.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® OG133-7
Flexible UV Cure
This is a single component, UV curable flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging.
EPO-TEK® OG133-8
UV Curable Epoxy
A single-component, thixotropic flexible epoxy/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, as well as low-stress bonding of fiber optic components, are typical applications.
