EPO-TEK® P10
Silver Die Attach Polyimide
A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.
EPO-TEK® P1011-2
SIlver Chip Bonding Polyimide
Single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronics and optoelectronic applications.
EPO-TEK® P1011-T2
Die Attach Polyimide
Electrically conductive, modified polyimide adhesive designed for die-attach of semiconductors and hybrid IC packaging.
EPO-TEK® P1011S-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging.
EPO-TEK® P1011ST-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging. It is a lower viscosity version of P1011-T2.
EPO-TEK® T-7
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in semiconductor, microelectronic, optoelectronics, and general electronic assembly applications. It can be used at the chip or PCB packaging level interconnect.
EPO-TEK® T606-3
Thermally Conductive Epoxy
Single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.
EPO-TEK® T6065
Thermally Conductive Epoxy
A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
EPO-TEK® T6067
Thermally Conductive Epoxy
A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.
