60-7156
Flexible UV Curable Adhesive & Potting Compound
UV 60-7156 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. Its low durometer (flexibility) provides less stress on sensitive electronic components. UV Cure 60-7156...
60-7158RTR
UV Curable Epoxy Adhesive
60-7158RTR is a UV Curable Epoxy Adhesive formulated to bond rigid substrates. This adhesive bonds extremely well to aluminum while also providing good water and chemical resistance. 60- 7158RTR is a semi-rigid adhesive and it is well suited...
60-7170RCL
UV Adhesive & Encapsulating Resin
60-7170RCL is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. 60-7155RCL is a lower viscosity version of 60-7170RCL.
70-3810
High Temperature Resistant Aluminum Filled Epoxy Resin
70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity.
70-3815
Thermally Conductive Epoxy Adhesive
70-3815 is an easy to use thermally conductive epoxy adhesive. It is formulated for electronic applications requiring fast heat dissipation. 70-3815 has a convenient one-to-one mix ratio by volume and has a spreadable non-sag thickness.
EPO-TEK® 301-2FL
Low Stress Optical Epoxy
This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding...