EPO-TEK® MED-H20E
Medical Grade Conductive Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.
EPO-TEK® MED-H20S
Electrically Conductive Adhesive
Biocompatible silver-filled epoxy with electrical and high thermal conductivity. It is a smooth low viscosity paste with silver particles. It is a well characterized and high reliability ECA, used most often for critical circuit connections and EMI coatings...
EPO-TEK® MED-HYB-353ND
Medical Grade UV Hybrid Epoxy
An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.
EPO-TEK® MED-OD2002
Optical Adhesive
EPO-TEK® MED-OD2002 is a biocompatible, high Tg, low modulus, high temperature epoxy, used primarily for fiber optics and endoscopes. It is highly autoclave resistant and when cured properly can withstand 1,000 autoclave cycles.
EPO-TEK® MED-OG116-31
UV & UV Hybrid
EPO-TEK® MED-OG116-31 is a biocompatible, one component, thixotropic, high Tg, cationic/epoxy UV curing adhesive. With thermal post curing, this UV has very high chemical resistance and is used in many types of implantable medical devices, specialized surgical and...
EPO-TEK® MED-OG198-54
UV & UV Hybrid
EPO-TEK® MED-OG198-54 is a biocompatible, clear, low viscosity, high Tg, high strength, cationic/epoxy UV curing adhesive. It has capillary wicking and is capable of reaching shadowed regions using an oven post cure. It is used in many types...
EPO-TEK® MED-OG198-55
Thixotropic UV Curing Epoxy
ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.
EPO-TEK® MED-T7110
Medical Grade Thermally Conductive Epoxy
ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.
EPO-TEK® OD1001
Thermally Conductive Epoxy
This single component epoxy is designed for low stress and semiconductor and electronics packaging. Low Tg, several weeks of pot lif and low modulus are a few of its traits.
