50-1220
One Component Silicone Thermal Grease
This is a heavy filled Heat Sink Compound promotes a high thermal conductivity, low bleed, and high temperature stability.
50-1225
Thermally Conductive Silicone Rubber
50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
50-1952
Thermally Conductive Silicone Potting & Encapsulating Compound
50-1952 is a two-component silicone potting and encapsulating compound. This silicone system is designed for quick thermal transfer away from heat generating electronic devices.
50-2366
Thermally Conductive Polyurethane Potting Compound
50-2366FR is a thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure.
50-2368
Thermally Conductive Polyurethane Potting Compound
50-2368FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366FR. 50-2368FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties
50-3100
High Thermal Conductivity Heat Transfer Epoxy Resin
50-3100R is designed for the fastest and most continuous high heat transfer. 50-3100R measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100R. This system can be easily...
50-3107
Low Viscosity Epoxy Potting Compound
50-3107 is a two-component potting and encapsulating compound. This system is designed to be self-extinguishing and meets the stringent requirements of UL 94-V0. 50-3107 is thermally conductive and is RoHS compliant.
50-3116
Thermally Conductive Flexible Epoxy Resin
50-3116 thermally conductive flexible epoxy formulation is designed for applications that require low stress during cure and electrical insulation.