Overview
Our encapsulating and potting compounds deliver reliable protection for sensitive components across demanding environments.
Available in epoxy, urethane, and silicone chemistries, these solutions offer viscosities from 250 cps to thixotropic pastes and pot lives ranging from minutes to hours. With operating temperatures from -70°C to +300°C, they meet standards like UL 94 V-0, NASA ASTM E595, ISO 10993-5, and FDA regulations. Features include excellent dielectric strength, chemical resistance, and thermal shock resistance. Select products are available in convenient Triggerbond® cartridges.
Urethane
20-2175
Potting & Encapsulating
Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.
20-2180 Series
Potting & Encapsulating
Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.
20-2362FR
Potting & Encapsulating
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
Epoxy
20-3060
Potting & Encapsulating
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
20-3302
Potting & Encapsulating
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
20-3305
Potting & Encapsulating
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
Silicone
20-1625
Potting & Encapsulating
Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.
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