EPO-TEK® T7109-17
Flexible Thermally Conductive Epoxy
This is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries.
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EPO-TEK® T7109-19
Flexible Thermally Conductive Epoxy
A two component, flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermal management.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® T7110-38
Thermally Conductive, Room-Temperature Cure Epoxy
This is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It is designed to be a higher viscosity and more thixotropic version of EPO-TEK® T7110.
EPO-TEK® T905BN-3
Thermally Conductive Epoxy
A thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.
EPO-TEK® TD1001
Thermally Conductive Epoxy
This is single component, thermally conductive, electrically insulating epoxy designed for lowstress semiconductor and electronics packaging.
EPO-TEK® TD1001-67
Thermally Conductive Epoxy
A soft single component, thermally conductive, electrically insulating epoxy. It is a more flexible version of EPO-TEK® TD1001. Optimal for stress relief applications with its low Tg and long pot life. Suitable for bonding ferrite cores in power...
EPO-TEK® TJ2139-LH Black
Thermally Conductive Epoxy
This two component epoxy is low-halogen, electrically insulating die attach adhesive with long pot life.
EPO-TEK® TV2001
Thermally Conductive Epoxy
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.