EPO-TEK® OG154-1
UV Optical Cure
A single compound UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry.
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EPO-TEK® OG159-2
Epoxy-Based Thermal Post-Cure
EPO-TEK® OG159-2 is a single component, high-viscosity, UV-curable epoxy for bonding glass plates in display applications. It’s thixotropic, moisture-resistant, and includes 1 mil glass beads for bond line control.
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG198-55-1
UV & UV Hybrid
High viscosity, single component, electrically and thermally insulating UV cure epoxy. It is a thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG198-55HV
UV & UV Hybrid
High viscosity, single component, electrically and thermally insulating UV cure epoxy. It is a higher viscosity version of EPO-TEK® OG198-55.
EPO-TEK® OG603
Acrylate-Based UV Cure
This all-purpose general adhesive is a single-component, low viscosity, UV-curable formula that cures in seconds for optical applications, medical uses, and PCB-level electro-optics. It is also suitable for sealing and coating applications.
EPO-TEK® OG675
Acrylate-Based UV Cure
A UV fast-curing, flexible adhesive with medium viscosity and optical clarity.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.