EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
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EPO-TEK® OG133-7
Flexible UV Cure
This is a single component, UV curable flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging.
EPO-TEK® OG133-8
UV Curable Epoxy
A single-component, thixotropic flexible epoxy/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, as well as low-stress bonding of fiber optic components, are typical applications.
EPO-TEK® OG142
UV & UV Hybrid
Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medica, and scientific/OEM industries.
EPO-TEK® OG142-112
UV Cure Optical Epoxy
This single component, low viscosity epoxy is designed for adhesive sealing and encasulating fiber optic and opto-clectronic packaging applications.
EPO-TEK® OG142-112LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
EPO-TEK® OG142-95
UV Curable Epoxy
A single component, low viscosity, UV curable epoxy. It is a replacement version of EPOTEK® OG142-17 with better bonding strength and moisture resistance; thermal post-cure beneficial.
EPO-TEK® OG148
UV & UV Hybrid
Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a clear, high Tg epoxy.