EPO-TEK® B9021
B-Stage Epoxy
Single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach.
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EPO-TEK® B9101-2 Unfilled
Nonconductive Adhesive
Single component, electrically and thermally insulating epoxy designed for adhesive, sealing, and potting of micro-electronics and semiconductor devices. Maybe used in industries such as military, automotive, optical, or medical electronics.
EPO-TEK® B9126-7
Thermally Conductive Epoxy
Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs,...
EPO-TEK® B9126-8
Thermally Conductive Epoxy
Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a long pot life, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when...
EPO-TEK® B9144
Nonconductive Adhesive
Two component, optically opaque and slightly flexible epoxy designed for low stress adhesive, potting, and sealing applications found in semiconductor, electronics, medical, and fiber optic industries.
EPO-TEK® CF-6
Hight Temperature Epoxy
EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging.
EPO-TEK® E2101
Electrically Conductive, Silver Epoxy
A two component, thixotropic, electrically conductive adhesive.
EPO-TEK® E3001-6
Electrically Conductive, Silver-Filled Epoxy
This is a single component, electrically and thermally conductive,snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK®...
EPO-TEK® E4110
Electrically Conductive Adhesive
EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.