20-3300
High Temperature & Thermal Shock Epoxy
20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
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20-3401
Medical, Optical & Semiconductor Grade Epoxy Resin
20-3401 is a two component clear epoxy resin system. It provides excellent optical transmission properties along with outstanding adhesion and electrical insulation.
20-3650
Epoxy Potting & Encapsulating Compound
20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system.
20-3652
Potting & Encapsulating Epoxy
20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties.
20-365240
Epoxy Potting & Encapsulating Compound
20-3652-40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652.
20-3660
High Temperature Epoxy Potting Compound
20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to its high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
30-3711
One Component Epoxy Coating
30-3711 is designed for coating and impregnating applications. It has excellent dielectric strength.
40-3900
Silver Filled Epoxy Resin
40-3900 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm.
40-3901
Electrically Conductive Epoxy Adhesive
NASA Low Outgassing silver filled epoxy with a volume resistivity of 10^-3.