Enhance®
Cutback Adhesive Encapsulator and Bond Promoter
Take your job site to the next level with Enhance. Its multi-functioning capabilities tackle many tough challenges such as detackifying or encapsulating existing adhesive residue, including cutback. Even difficult-to-bond substrates are no match for the textured surface profile...
EP100-SEAL LM
Low Viscosity Epoxy Sealer
EP100-SEAL LM is a highly penetrating, two-component epoxy healer/sealer.
DOT Approval File
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® 323LP
High Temperature Optical Epoxy
Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.
EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® EK1000
Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® H20E-HC
High Thermal Conductivity Epoxy
High thermal conductivity version of EPO-TEK® H20E.