20-3006
Flexible Epoxy Potting & Encapsulating Compound
20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance.
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20-3030
Epoxy Potting & Casting Resin
20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self-leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure at room temperature
20-3035
Low Density Epoxy Potting Compound
20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds
20-3036
Low Density Epoxy Syntactic Foam
20 3036 is a lightweight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio
20-3037
Low Density Epoxy Adhesive & Sealant
20-3037 is a low density, two component epoxy bonding and sealing system. The 20-3037 is less than half the weight of most commercially available potting compounds.
20-3038
Low Density Syntactic Foam Epoxy
20-3038 is a lightweight epoxy for potting, casting, and encapsulating electronic components and assemblies.
20-3063
Epoxy Potting & Encapsulating Compound
20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process.
20-3064
Flexible Epoxy Potting Compound & Adhesive
20-3064 NC is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio, the hardness can be varied from 60 Shore A...
20-3065
Low Viscosity Potting & Encapsulating Resin
20-3065 NC is a general purpose, low viscosity epoxy potting and encapsulating resin system.