EPO-TEK® H20E-PFC
Electrically Conductive, Silver Epoxy
Temiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.
EPO-TEK® H20F
Electrically Conductive Adhesive
EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EPO-TEK® H20S-D
Electrically Conductive Adhesive
Single component, silver-filled epoxy with a smooth, thixotropic consistency primarily designed for enhanced dispensing.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® H22
Electrical Conductive, Silver Epoxy
This silver-filled system is engineered specifically for die bonding and sealing hybrid circuit packages.
EPO-TEK® H24
Electrically Conductive Adhesive
EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.
EPO-TEK® H27D
Electrically Conductive Adhesive
Two component, silver-filled adhesive designed for semiconductor and hybrid microelectronic packaging applications.
EPO-TEK® H31
Electrically Conductive Adhesive
EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.
