EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H70E-1
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor and microelectronic packaging. It is most commonly used for die-attach and heat sinking applications.
EPO-TEK® H70E-175
Thermally Conductive Epoxy
EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB...
EPO-TEK® H70E-2LC
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling.
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
EPO-TEK® H72
Thermally Conductive Epoxy
EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.
EPO-TEK® H73
Thermally Conductive Epoxy
EPO-TEK® H73 is a two component, thermally conductive, electrically insulating epoxy. It is a higher viscosity alternative to EPO-TEK® H74.
EPO-TEK® H74-110
Nonconductive Epoxy Adhesive
Two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, and optical applications. It is an IR transparent version of EPO-TEK® H74 which enables fiber optic and photonic-packaging.
EPO-TEK® H74F
Thermally Conductive Epoxy
A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber...
