EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
EPO-TEK® OD121-42
Underfill Epoxy
EPO-TEK® OD121-42 (formerly R&D # 121-4-2) is a single component, low temperature cure epoxy with long pot life. It is designed for capillary underfill of heat sensitive electronic component packaging.
EPO-TEK® OD1361
Underfill Epoxy
Optically opaque epoxy specially designed as the dam component for dam and fill applications in combination with either EPO-TEK® 121-136-3 or EPO-TEK® 121-36-4 fill formulations. It can be used for adhesive, sealing, and encapsulation applications in semiconductor, electro-optics,...
EPO-TEK® OE100-T
Nonconductive Adhesive
A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.
EPO-TEK® OE101
Optical Adhesive
Two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semi-conductors. It is a lower modulus version of EPO-TEK® 353ND.
EPO-TEK® OE107M
Nonconductive Adhesive
A clear, flexible epoxy used for low stress adhesive and potting applications.
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® OE132-43
Optical Adhesive
Single component, solvent containint low viscosity polyimide designed for high temperature applications found in demiconductor, hybrid, and optical applications. It is used mostly as a coating and dielectric layer. It is a REACH compliant version of OE132.
