EPO-TEK® B9126-7
Thermally Conductive Epoxy
Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs,...
EPO-TEK® B9126-8
Thermally Conductive Epoxy
Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a long pot life, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when...
EPO-TEK® B9144
Nonconductive Adhesive
Two component, optically opaque and slightly flexible epoxy designed for low stress adhesive, potting, and sealing applications found in semiconductor, electronics, medical, and fiber optic industries.
EPO-TEK® CF-6
Hight Temperature Epoxy
EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging.
EPO-TEK® E4110
Electrically Conductive Adhesive
EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® E4110-LV
Electrically Conductive Adhesive
EPO-TEK® E4110LV is an electrically conductive, silver-filled flowing epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® E4110-PFC
Electrically Conductive Adhesive
Two component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.
EPO-TEK® EE178-9
Electrically Conductive Adhesive
A two component, electrically conductive epoxy adhesive designed for semiconductor, hybrid, PCB and optoelectronic assemblies. It was designed for precision dispensing or stamping of small dot arrays, in ultra fine pitch applications such as connectors to flex-PCB, SMD...
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
