EPO-TEK® EE178-9
Electrically Conductive Adhesive
A two component, electrically conductive epoxy adhesive designed for semiconductor, hybrid, PCB and optoelectronic assemblies. It was designed for precision dispensing or stamping of small dot arrays, in ultra fine pitch applications such as connectors to flex-PCB, SMD...
EPO-TEK® EJ2108
Flexible, Silver-filled Adhesive
This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.
EPO-TEK® EJ2189
Electrically Conductive Epoxy
This is an silver-filled epoxy paste designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® EK1000-1MP
Electrically Conductive, Silver Epoxy
This single component product offers exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK® EK1000-MP and is designed for applications requiring long work times including hybrid die...
EPO-TEK® EK1000-MP
Silver Conductive Epoxy
A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.
EPO-TEK® EM127
Electrically Conductive Adhesive
Single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.
EPO-TEK® EV2118-2
Silver Conductive Epoxy
A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
EPO-TEK® GD2191
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy with long pot life and adhesion to stainless steel.
