EPO-TEK® GE120
Nonconductive Adhesive
Single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to PCBs. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, automotive, and scientific/OEM.
EPO-TEK® H20E-175
Electrically Conductive Adhesive
Two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor/JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.
EPO-TEK® H20E-8
Electrically Conductive Adhesive
Two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
EPO-TEK® H20E-D
Electrically Conductive Adhesive
Single component, 100% solids, silver-filed epoxy designed for electrically and thermally conductive bonds. It is an enhanced version of EPO-TEK® H20E.
EPO-TEK® H20E-FC
Electrically Conductive, Silver Epoxy
EPO-TEK® H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.
EPO-TEK® H20E-LC
Electrically Conductive Adhesive
EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself...
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EPO-TEK® H20F
Electrically Conductive Adhesive
EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
