EPO-TEK® OJ2933-LH
Nonconductive Adhesive
Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND.
EPO-TEK® OM118
Nonconductive Epoxy Adhesive
Two component, optically clear, electrically and thermally insulating epoxy designed for adhesive, sealing, and encapsulation applications found in semiconductor, medical, filtration, and scientific/OEM industries. It is a slightly higher viscosity and Tg alternative to EPO-TEK® 301.
EPO-TEK® P10
Silver Die Attach Polyimide
A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.
EPO-TEK® P1011-2
SIlver Chip Bonding Polyimide
Single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronics and optoelectronic applications.
EPO-TEK® P1011-T2
Die Attach Polyimide
Electrically conductive, modified polyimide adhesive designed for die-attach of semiconductors and hybrid IC packaging.
EPO-TEK® P1011S-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging.
EPO-TEK® P1011ST-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging. It is a lower viscosity version of P1011-T2.
EPO-TEK® T-7
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in semiconductor, microelectronic, optoelectronics, and general electronic assembly applications. It can be used at the chip or PCB packaging level interconnect.
