EPO-TEK® H31D
Electrically Conductive Adhesive
EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® H44
Electrically Conductive Adhesive
Single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.
EPO-TEK® H54
Nonconductive Adhesive
Two component, high Tg, electrically, and thermally insulating epoxy adhesive for general bonding and high temperature packaging in hybrid and optical industries.
EPO-TEK® H61-110
Nonconductive Adhesive
A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of EPO-TEK® H61.
EPO-TEK® H61LV
Thermally Conductive Epoxy
Single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
