EPO-TEK® H44
Electrically Conductive Adhesive
Single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.
EPO-TEK® H54
Nonconductive Adhesive
Two component, high Tg, electrically, and thermally insulating epoxy adhesive for general bonding and high temperature packaging in hybrid and optical industries.
EPO-TEK® H61-110
Nonconductive Adhesive
A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of EPO-TEK® H61.
EPO-TEK® H61LV
Thermally Conductive Epoxy
Single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.
EPO-TEK® H67-MP
Thermally Conductive Epoxy
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H70E-1
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor and microelectronic packaging. It is most commonly used for die-attach and heat sinking applications.
EPO-TEK® H70E-175
Thermally Conductive Epoxy
EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB...
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
