EPO-TEK® OG154-1
UV Optical Cure
A single compound UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry.
EPO-TEK® OG159-2
Epoxy-Based Thermal Post-Cure
EPO-TEK® OG159-2 is a single component, high-viscosity, UV-curable epoxy for bonding glass plates in display applications. It’s thixotropic, moisture-resistant, and includes 1 mil glass beads for bond line control.
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG603
Acrylate-Based UV Cure
This all-purpose general adhesive is a single-component, low viscosity, UV-curable formula that cures in seconds for optical applications, medical uses, and PCB-level electro-optics. It is also suitable for sealing and coating applications.
EPO-TEK® OG653
Acrylate-Based UV Cure
UV curable adhesive designed for glob top encapsulation.
EPO-TEK® OG675
Acrylate-Based UV Cure
A UV fast-curing, flexible adhesive with medium viscosity and optical clarity.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
