EPO-TEK® TJ2139-LH Black
Thermally Conductive Epoxy
This two component epoxy is low-halogen, electrically insulating die attach adhesive with long pot life.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® UD1355
Epoxy-Based Thermal Post Cure
Optically clear, low-viscosity UV adhesive and encapsulant with resistance to discoloration during solder reflow.
EPX50-OVERLAY
Moisture Insensitive Epoxy Polymer Overlay
EPX50-OVERLAY is a moisture-insensitive, low-modulus, 3/8” two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as...
EPX50-OVERLAY FAST
Rapid Set Epoxy Urethane
EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...
EPX50LT-OVERLAY
Epoxy Urethane Polymer Resin
EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.
HFP 1:1
Advanced Surface Polymer
HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.
MIRACLE BOND® Repair Epoxy
Muti-Purpose Epoxy Concrete Repair
MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...
