EPO-TEK® MED-T7110
Medical Grade Thermally Conductive Epoxy
ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.
EPO-TEK® N20E
Electrically Conductive Adhesive
EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer, and industrial industries.
EPO-TEK® OD1001
Thermally Conductive Epoxy
This single component epoxy is designed for low stress and semiconductor and electronics packaging. Low Tg, several weeks of pot lif and low modulus are a few of its traits.
EPO-TEK® OD121-42
Underfill Epoxy
EPO-TEK® OD121-42 (formerly R&D # 121-4-2) is a single component, low temperature cure epoxy with long pot life. It is designed for capillary underfill of heat sensitive electronic component packaging.
EPO-TEK® OD1361
Underfill Epoxy
Optically opaque epoxy specially designed as the dam component for dam and fill applications in combination with either EPO-TEK® 121-136-3 or EPO-TEK® 121-36-4 fill formulations. It can be used for adhesive, sealing, and encapsulation applications in semiconductor, electro-optics,...
EPO-TEK® OE101
Optical Adhesive
Two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semi-conductors. It is a lower modulus version of EPO-TEK® 353ND.
EPO-TEK® OE101-T
Nonconductive Adhesive
A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.
EPO-TEK® OE107M
Nonconductive Adhesive
A clear, flexible epoxy used for low stress adhesive and potting applications.
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
