EPO-TEK® 730-110 Black
Nonconductive Adhesive
Two component, room temperature curing general and structural grade epoxy. Can be used as an adhesive or for sealing and encapsulating applications in medical, X-Ray devices, filtration, opto-electronics, and PCB industries.
EPO-TEK® B9021
B-Stage Epoxy
Single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach.
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® H72
Thermally Conductive Epoxy
EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.
