EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.
EP75-SEAL
Penetrating Healer and Urethane Sealer
EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® 301-1
Spectrally Transparent Epoxy
This is a two-component, room temperature curing epoxy featuring very low viscosity and excellent optical and mechanical properties. It is a lower viscosity version of EPO-TEK® 301.
EPO-TEK® 301-104
Spectrally Transparent Epoxy
EPO-TEK® 301-104 is a single component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® 301-2FL
Low Stress Optical Epoxy
This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding...
EPO-TEK® 301-2FL-CX
Low Viscosity Optical Epoxy
This a two component optical epoxy low index version of EPO-TEK® 301-2FL. It features very low viscosity and excellent optical-mechanical properties.
EPO-TEK® 301-2FL-G
Low Stress, Optical Epoxy
EPO-TEK® 301-2FL-G is a two component optical and semiconductor grade epoxy resin. It is a version of EPO-TEK® 301-2FL with an indicator added for enhanced process control.
