EPO-TEK® 921
High Tg,Thermally Conductive, Electrically Insulating Epoxy
Designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® B13181
Thermally Conductive Epoxy
A single component, thermally conductive, low-halogen, B-Stage epoxy paste.
EPO-TEK® E2101
Electrically Conductive, Silver Epoxy
A two component, thixotropic, electrically conductive adhesive.
EPO-TEK® E3001-6
Electrically Conductive, Silver-Filled Epoxy
This is a single component, electrically and thermally conductive,snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK®...
EPO-TEK® EJ2108
Flexible, Silver-filled Adhesive
This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.
EPO-TEK® EJ2189
Electrically Conductive Epoxy
This is an silver-filled epoxy paste designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® EJ2189-LV
Electrically Conductive Epoxy
This is an electrically conductive silver-filled epoxy paste designed for low temperature curing from ambient to 80°C.
EPO-TEK® EJ2312
Room Temperature Curing ECA
Two component room temperature curing electrically conductive adhesive.
