10-3004NC
Low Viscosity, Adjustable Flexibility Epoxy Adhesive
10-3004NC is a high bond strength epoxy adhesive, with a non-critical mix ratio and adjustable flexibility. 10-3004NC yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high-performance epoxy...
10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
10-3006
Non-Sag Patch & Repair Epoxy System
10-3006 is a non-sag fast setting patch & repair epoxy system and is dry to the touch in 5-10 minutes.
10-3009NC
Low Viscosity Epoxy Adhesive & Potting Compound
10-3009 NC is a low viscosity epoxy adhesive and potting compound. This product offers a good combination of peel and tensile strength. 10-3009 NC provides electrical insulation and outstanding adhesion.
10-3013
Instant Setting Cyanoacrylate Adhesive
10-3013 is a medium viscosity, instant setting Ethyl Cyanoacrylate adhesive. This fast-setting adhesive is formulated for the bonding of plastics, rubbers, paper, metals, and other common substrates.
10-3016
Adhesives & Sealants
10-3016NC is a two-component epoxy adhesive and sealant. This system is a low viscosity and unfilled. It can be pigmented if required.
10-3020
Fast Cure Thixotropic Epoxy Adhesive
10-3020 is part of the 10-3005 series and is a high bond strength adhesive. 10-3020 has a quick setting time of 20 minutes at room temperature. It is excellent for bonding plated metals, glass, wood, ceramic, felt, cement,...
10-3022
Epoxy SMT Stencil Assembly Adhesive
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance.
10-3026
Fast Setting Epoxy Adhesive & Encapsulant
10-3026 is a clear, fast setting adhesive and encapsulant with a good dielectric strength ideal for small electronic potting and encapsulating.
