EPO-TEK® 930
Thermally Conductive Epoxy
Two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, or optics.
EPO-TEK® 930-4
Thermally Conductive Epoxy Adhesive
Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe.
EPO-TEK® B9021
B-Stage Epoxy
Single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach.
EPO-TEK® B9101-2 Unfilled
Nonconductive Adhesive
Single component, electrically and thermally insulating epoxy designed for adhesive, sealing, and potting of micro-electronics and semiconductor devices.
EPO-TEK® B9126-7
Thermally Conductive Epoxy
Single component, thermally and electrically conductive epoxy adhesive designed for semiconductor die attach and circuit assembly applications. It has a low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs,...
EPO-TEK® B9144
Nonconductive Adhesive
Two component, optically opaque and slightly flexible epoxy designed for low stress adhesive, potting, and sealing applications found in semiconductor, electronics, medical, and fiber optic industries.
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® GD2191
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy with long pot life and adhesion to stainless steel.
EPO-TEK® H20E-8
Electrically Conductive Adhesive
Two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
