EPO-TEK® H20E-HC
Electrically & Thermally Conductive Epoxy
High thermal conductivity version of EPO-TEK® H20E.
EPO-TEK® H20E-MP
Electrically & Thermally Conductive Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EPO-TEK® H20S
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic
EPO-TEK® H21D
Electrically & Thermally Conductive Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® H35-175MP
Electrically & Thermally Conductive Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H37-MP
Electrically & Thermally Conductive Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® H67-MP
Thermally Conductive Adhesive
Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.
EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
