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ASI COMPOUND 70

ASI COMPOUND 70

Multi-Purpose Silicone Grease and Lubricant

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

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EPO-TEK® 301-2

EPO-TEK® 301-2

Optically Transparent Epoxy Resin

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. 

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EPO-TEK® 320

EPO-TEK® 320

Thixotropic Optical Epoxy Adhesive

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

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EPO-TEK® 343ND-LH

EPO-TEK® 343ND-LH

Optical Epoxy Adhesive

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

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EPO-TEK® 730

EPO-TEK® 730

Thixotropic Epoxy Adhesive

All purpose thixotropic and room temperature-curing epoxy adhesive.

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EPO-TEK® 730-110

EPO-TEK® 730-110

Thermally and Electrically Insulating Epoxy

Room temperature-curing, thermally and electrically insulating epoxy.

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EPO-TEK® 930-4

EPO-TEK® 930-4

Thermally Conductive Epoxy Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

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EPO-TEK® EK1000

EPO-TEK® EK1000

Electrically Conductive Silver Filled Adhesive

High thermal conductive silver filled adhesive.

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EPO-TEK® H70E

EPO-TEK® H70E

Electrically Insulating Epoxy

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

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