![50-2369FR](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/8lqlwq94zy5b5bys7glwqjrzgl9vuxnz/50-2369fr-thumbnail.png/50-2369fr-thumbnail.q80w576h576.png)
50-2369FR
Thermally Conductive
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
![50-3152FR](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/0a7crxfswzpuexyoppyzt90fcibzj800/50-3152-thumbnail.png/50-3152-thumbnail.q80w576h576.png)
50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
![50-3170](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/lkfnna1dlkpzsmnh51adj30engwda0jq/50-2369fr-thumbnail.png/50-2369fr-thumbnail.q80w576h576.png)
50-3170
Thermally Conductive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
![EPO-TEK® EK1000](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/qe1ifpa5cgaezbj9fszhmqixcajqv3os/ek1000-thumbnail.png/ek1000-thumbnail.q80w576h576.png)
EPO-TEK® EK1000
Electrically & Thermally Conductive Epoxy
High thermal conductive silver filled adhesive.
![EPO-TEK® H20E](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/jhvw9izxftbgr0ebyklvxufvdiriofcd/h20e-thumbnail.png/h20e-thumbnail.q80w576h576.png)
EPO-TEK® H20E
Electrically & Thermally Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
![EPO-TEK® H70E](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/gsa2t6qkf4tunuyhssxphnwv9zqq1by3/epo-tek-h70e-thumbnail-image-576x576.png/epo-tek-h70e-thumbnail-image-576x576.q80w576h576.png)
EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
![EPO-TEK® OG116-31](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/jbalige4lc4cf4ub8sluyg6zde3hsiak/epotek-og116-31-thumbnail-image-576x576.png/epotek-og116-31-thumbnail-image-576x576.q80w576h576.png)
EPO-TEK® OG116-31
UV Curable Epoxy
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
![EPO-TEK® TZ101](https://meridianadhesives.com/wp-content/srcsets/app/product/thumbnail/xba9jsi9cizvttydwbryk3syyjudggty/930-4-thumbnail.png/930-4-thumbnail.q80w576h576.png)
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.