EPO-TEK® H77 - Thermally Conductive, Electrically Insulating Epoxy

Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.

A premium quality, solvent based, high performance, fast drying, non-flammable, industrial contact insulation adhesive that is water resistant and temperature resistant to 200°F. DP 2595 is formulated for adhering closed cell foam, higher density insulation and applications that...

Tried and true for more than 20 years, ULTRABOND 1 has numerous DOT approvals and is available in bulk and cartridge in a multitude of sizes with a 1:1 mix ratio that makes it much easier to use....

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

All purpose thixotropic and room temperature-curing epoxy adhesive.

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...