EPO-TEK® H77 - Thermally Conductive, Electrically Insulating Epoxy

XD-CURE is a clear, odorless, water-based concrete curing compound that is formulated to ensure proper concretestrength development, help prevent shrinkage cracks, and leave a bondable surface for further coatings, treatments or flooring materials.

A high-performance HVAC, industrial, commercial, and residential construction grade 100% Acetoxy RTV Silicone adhesive/sealant that is UL and NSF Recognized.  It has excellent resistance to aging, weathering, and UV degradation. DP 502 will provide long term performance on...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

EP15-GROUT by E-Chem is a three-component, 100% solids, high-performance, epoxy machine grout designed for high-stress machine base plate grouting applications in the heavy industrial equipment industries. New equipment installations or quick re-grouting applications subject to chemical attack and...

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.