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30-3711

One Component Epoxy Coating

 30-3711 is designed for coating and impregnating applications. It has excellent dielectric strength.

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40-3900

Silver Filled Epoxy Resin

40-3900 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 

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40-3901

Electrically Conductive Epoxy Adhesive

NASA Low Outgassing silver filled epoxy with a volume resistivity of 10^-3.

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40-3905

Electrically Conductive Epoxy Adhesive & Coating

40-3905 is an electrically conductive epoxy system designed for applications requiring low temperature cures.

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40-3907

Electrically Conductive Epoxy Adhesive

40-3907 is an electrically conductive epoxy system designed for applications requiring low temperature cures 

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50-1220

One Component Silicone Thermal Grease

This is a heavy filled Heat Sink Compound promotes a high thermal conductivity, low bleed, and high temperature stability. 

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50-1225

Thermally Conductive Silicone Rubber

50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. 

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50-1952

Thermally Conductive Silicone Potting & Encapsulating Compound

50-1952 is a two-component silicone potting and encapsulating compound. This silicone system is designed for quick thermal transfer away from heat generating electronic devices. 

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50-2366

Thermally Conductive Polyurethane Potting Compound

50-2366FR is a thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure.