20-3036
Low Density Epoxy Syntactic Foam
20 3036 is a lightweight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio
20-3037
Low Density Epoxy Adhesive & Sealant
20-3037 is a low density, two component epoxy bonding and sealing system. The 20-3037 is less than half the weight of most commercially available potting compounds.
20-3063
Epoxy Potting & Encapsulating Compound
20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process.
20-3064
Flexible Epoxy Potting Compound & Adhesive
20-3064 NC is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio, the hardness can be varied from 60 Shore A...
20-3068
Epoxy Adhesive & Potting Compound
20-3068 is a room temperature curing, two component, epoxy potting compound and adhesive. This product provides good water resistance, adhesion, and toughness.
