20-3290
Potting, Encapsulating & Casting Epoxy Resin
20-3290 is a high temperature two-part epoxy system. This system has low coefficient of thermal expansion, good thermal shock resistance and high temperature service.
20-3300
High Temperature & Thermal Shock Epoxy
20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
20-3401
Medical, Optical & Semiconductor Grade Epoxy Resin
20-3401 is a two component clear epoxy resin system. It provides excellent optical transmission properties along with outstanding adhesion and electrical insulation.
20-3652
Potting & Encapsulating Epoxy
20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties.
30-3711
One Component Epoxy Coating
30-3711 is designed for coating and impregnating applications. It has excellent dielectric strength.
