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EPO-TEK® H77

Thermally Conductive, Electrically Insulating Epoxy

Designed for lid sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases, or ceramic.

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EPO-TEK® H77 Black

Thermally Conductive Epoxy

EPO-TEK® H77 Black is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal...

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EPO-TEK® H77S

Thermally Conductive, Electrically Insulating Epoxy

This two component epoxy is a thermally conductive, electrically insulating epoxy is design for high temperature applications.  It is a smaller particle version of EPO-TEK® H77.

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EPO-TEK® H81

Electrically Conductive Adhesive

A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

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EPO-TEK® H81A

Electrically Conductive Epoxy

A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

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EPO-TEK® HYB-297-RT

UV & UV Hybrid

Single component epoxy for fiber optic and semiconductor applications. It is designed to have similar cured performance to EPO-TEK® 301-2, but has been modified to allow for initial UV tacking to simplify the production process.

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EPO-TEK® HYB-297-RT-HV

UV & UV Hybrid

Single component epoxy for fiber optic and semiconductor applications. It is a higher viscosity version of EPO-TEK® HYB-297-RT. It is designed to have similar cured performance to EPO-TEK® 301-2, btu has been modified to allow for initial UV...

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EPO-TEK® HYB-353ND

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

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EPO-TEK® HYB-353ND-HV

UV Hybrid Curing Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...